Title :
Measurement of a 24-GHz broad-band multilayer ceramic feedthru for microwave packaging
Author :
Goetz, Martin P. ; Mancias, Gregorio, III
Author_Institution :
Alcoa Electron. Packaging Inc., San Diego, CA, USA
fDate :
5/1/1992 12:00:00 AM
Abstract :
A feedthrough using a microstrip to stripline to conductor backed coplanar waveguide (CBCWG) design was investigated for microwave performance. The feedthrough was manufactured using a high-temperature cofired multilayer ceramic process. The study was instigated from the need to have a field-replaceable, Ku-band transmit/receive module as part of an existing DARPA MIMIC program. The result is a feedthrough capable of transmitting microwave frequencies to 24 GHz with acceptable loss characteristics. The feedthrough performance exceeds published results.<>
Keywords :
integrated circuit technology; microwave integrated circuits; modules; packaging; strip line components; 24 GHz; CPW; DARPA MIMIC program; Ku-band; MIC; MLC; SHF; broadband type; cofired multilayer ceramic process; coplanar waveguide; feedthrough; field replaceable module; high-temperature; interconnect technology; microwave packaging; transmit/receive module; Ceramics; Coplanar waveguides; Microstrip; Microwave devices; Microwave measurements; Nonhomogeneous media; Packaging; Routing; Stripline; Vehicles;
Journal_Title :
Microwave and Guided Wave Letters, IEEE
