Abstract :
3D Integration is a promising and attractive solution for interconnect bottleneck problem, transistor scaling physical limitations, and impractical small-scale lithography. 3D integration extends Moore´s law in the third dimension, offering heterogeneous integration, higher density, lower power consumption, and faster performance. However, in order to fabricate 3D ICs, new capabilities are needed: process technology, physical modeling, physical design tools, 3D architectures, design methods and tools. The goal of this paper is to cover the manufacturability of TSV-based 3D-ICs Le. process technology, and fabrication capability.
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit manufacture; integrated circuit modelling; semiconductor process modelling; three-dimensional integrated circuits; 3D ICs; 3D architectures; TSV-based 3D integration fabrication; design methods; physical design tools; physical modeling; process technology; Bonding; Silicon; Stacking; Substrates; Three-dimensional displays; Through-silicon vias; 3D Integration; 3D Process; 3D Technology; 3D fabrication; 3D technologies; TSV;
