• DocumentCode
    1133594
  • Title

    A Nonlinear Microcontroller Power Distribution Network Model for the Characterization of Immunity to Electrical Fast Transients

  • Author

    Koo, Jayong ; Han, Lijun ; Herrin, Scott ; Moseley, Richard ; Carlton, Ross ; Beetner, Daryl G. ; Pommerenke, David

  • Author_Institution
    Intel Corp., Hillsboro, OR, USA
  • Volume
    51
  • Issue
    3
  • fYear
    2009
  • Firstpage
    611
  • Lastpage
    619
  • Abstract
    A nonlinear power distribution network model for characterizing the immunity of integrated circuits (ICs) to electrical fast transients (EFTs) is proposed and validated. The model includes electrostatic discharge (ESD) protection diodes and passive impedances between power domains. Model parameters are based on external measurements using a vector network analyzer and curve tracer. Impedance is measured between pins while the IC is biased and operating, and is used to determine individual elements of the network model. Inclusion of active power-clamp circuitry is also explored. The model is able to successfully predict pin currents and voltages during EFTs on the power pin when the IC is operating or turned off and when the ESD power clamp is either activated or not activated. This model might be used to evaluate the immunity of the IC in a variety of systems and to better understand why failures occur within the IC and how to fix them.
  • Keywords
    clamps; microcontrollers; network analysers; power integrated circuits; transient response; active power-clamp circuitry; curve tracer; electrical fast transient; electrostatic discharge protection diodes; integrated circuits; nonlinear microcontroller power distribution network model; passive impedance; vector network analyzer; Diodes; Electrostatic discharge; Electrostatic measurements; Impedance measurement; Integrated circuit measurements; Integrated circuit modeling; Microcontrollers; Pins; Power systems; Protection; Electrostatic discharge (ESD); modeling; power distribution;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/TEMC.2009.2023670
  • Filename
    5164925