Title :
Testing of full size high current superconductors in SULTAN III
Author :
Blau, B. ; Rohleder, I. ; Vecsey, G. ; Pasotti, G. ; Ricci, N.V. ; Sacchetti, N. ; Bruzzone, P. ; Katheder, H. ; Mitchell, N. ; Bessette, D. ; Duchateau, J.L.
Author_Institution :
Paul Scherrer Inst., Villigen, Switzerland
fDate :
7/1/1994 12:00:00 AM
Abstract :
The high field test facility SULTAN III in operation at PSI/Switzerland tests full size industrial prototype superconductors for fusion applications such as ITER. The facility provides a background field of up to 11 T over a length of 58 cm. A 50 kA superconducting transformer works as a very low noise current source which allows a criterion of 0.1 μV/cm to determine the superconducting to normal transition. Three 3.6 m long cable-in-conduit conductors based on both NbTi and Nb3Sn, developed by different manufacturers, suitable for the central solenoid and toroidal field coils of ITER, have been tested so far. This paper presents the results of extensive measurements of critical current and current sharing temperature of the Nb3Sn conductors in the 8-11 T range for temperatures between 4.5 K and 11 K. Voltage versus current curves have been analyzed with respect to the n value. The manufacturing of a high quality joint between two Nb3Sn conductors after heat treatment is reported, together with some measurements of the joint resistance
Keywords :
Tokamak devices; critical current density (superconductivity); fusion reactor theory and design; superconducting magnets; 11 T; 3.6 m; 4.5 to 11 K; 50 kA; 58 cm; 8 to 11 T; ITER; Nb3Sn; NbTi; SULTAN III; cable-in-conduit conductors; central solenoid; full size high current superconductors; fusion applications; high field test facility; industrial prototype superconductors; joint resistance; superconducting transformer; toroidal field coils; Conductors; Manufacturing; Niobium; Superconducting cables; Superconducting coils; Superconducting device noise; Superconductivity; Temperature distribution; Testing; Tin;
Journal_Title :
Magnetics, IEEE Transactions on