Characterization of liquid crystal polymer for high frequency system-in-a-package applications

Author

Zou, Gang ; Grönqvist, Hans ; Starski, J. Piotr ; Liu, Johan

Author_Institution

Sch. of Mech. Eng., Chalmers Univ. of Technol., Goteborg, Sweden

Volume

25

Issue

4

fYear

2002

fDate

11/1/2002 12:00:00 AM

Firstpage

503

Lastpage

508

Abstract

Liquid crystal polymer (LCP) is a promising substrate for electronics packaging. In this paper, the high frequency characteristics of LCP were investigated using a microstrip ring resonator to verify the possibility of applying the material in RF packaging. The relative dielectric constant and the loss tangent have been measured. The radiation loss of the ring is considered to accurately determine the loss tangent. A GaAs MMIC switch circuit was fabricated using LCP as substrate to demonstrate the application of this material for system-in-a-package. From the high frequency measurements, it is shown that LCP has low dielectric constant and low loss tangent in the frequency range from 1 GHz to 35 GHz. It is also found that LCP can be used in system-in-a-package applications.

Keywords

MMIC; dielectric losses; integrated circuit packaging; liquid crystal polymers; microstrip resonators; microwave materials; microwave switches; permittivity; 1 to 35 GHz; GaAs; GaAs MMIC switch circuit; RF packaging; electronics packaging substrate; high frequency characteristics; high frequency system-in-a-package; liquid crystal polymer; loss tangent; microstrip ring resonator; radiation loss; relative dielectric constant; Dielectric constant; Dielectric loss measurement; Dielectric materials; Dielectric substrates; Electronics packaging; Frequency; Liquid crystal polymers; Microstrip resonators; Optical ring resonators; Switches;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2002.807593

Filename

1176476