Title :
Equivalent network synthesis for via holes discontinuities
Author :
Antonini, Giulio ; Scogna, Antonio Ciccomancini ; Orlandi, Antonio
Author_Institution :
Dept. of Electr. Eng., Univ. of L´´Aquila, Italy
fDate :
11/1/2002 12:00:00 AM
Abstract :
A methodology is presented for the synthesis of the passive equivalent circuit of via holes in multilayer printed circuit boards. The paper describes the network synthesis starting from the extraction of the poles and residues from the driving point transfer functions for two port networks. The via hole is partitioned into elementary structures assumed not electromagnetically coupled and the scattering parameters for each one of them are evaluated by using a numerical approach suitably validated by comparison with results computed by other independent numerical methods. The equivalent circuit of the complete via hole is given by the cascading of the circuits of the elementary structures. The proposed technique is validated by comparing the computed scattering parameters with those from measurements for real test boards.
Keywords :
S-parameters; cascade networks; circuit simulation; equivalent circuits; finite difference time-domain analysis; interconnections; linear network synthesis; passive networks; poles and zeros; printed circuit layout; transmission line theory; two-port networks; FDTD simulation; PCB layout; circuit extraction procedure; driving point transfer functions; elementary structure circuit cascading; equivalent network synthesis; high-speed interconnects; multilayer printed circuit boards; numerical approach; passive equivalent circuit synthesis; pole extraction; residue extraction; scattering parameters; signal integrity; test boards; transmission line modeling; two port networks; via hole partitioning; via holes discontinuities; Circuit synthesis; Circuit testing; Coupling circuits; Electromagnetic coupling; Equivalent circuits; Network synthesis; Nonhomogeneous media; Printed circuits; Scattering parameters; Transfer functions;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2002.807563