• DocumentCode
    1134966
  • Title

    A V-Band Parallel-Feedback Oscillator With a Micromachined Cavity Integrated on a Thin-Film Substrate

  • Author

    Song, Sangsub ; Kim, Youngmin ; Choi, Wooyeol ; Kwon, Youngwoo ; Seo, Kwang-Seok

  • Author_Institution
    Sch. of Electr. Eng., Seoul Nat. Univ., Seoul
  • Volume
    19
  • Issue
    2
  • fYear
    2009
  • Firstpage
    107
  • Lastpage
    109
  • Abstract
    This letter presents a V-band cavity oscillator based on a thin-film substrate with a flip-chip interconnection. A cavity serves as a parallel-feedback element, which is fabricated using a micromachining technique and is flip-chip mounted on a thin-film substrate with integrated passives. A GaAs pseudomorphic high electron-mobility transistor is flip-chip mounted on the thin-film substrate as an active device to generate negative resistance. The fabricated cavity with I/O ports in the same side has a loaded Q of 352, a coupling of 5.3 dB, and a resonant frequency of 59.88 GHz. The developed parallel-feedback cavity oscillator has an output power of about 9.7 dBm and a low phase noise of -112 dBc/Hz at 1 MHz offset with an oscillation frequency at 59.84 GHz. This work allows a low-cost mm-wave frequency source with high performances.
  • Keywords
    III-V semiconductors; MIMIC; feedback oscillators; flip-chip devices; gallium arsenide; high electron mobility transistors; integrated circuit interconnections; millimetre wave oscillators; phase noise; GaAs; V-band cavity oscillator; coupling; flip-chip; flip-chip interconnection; frequency 59.84 GHz; frequency 59.88 GHz; micromachining; mm-wave frequency source; negative resistance; oscillation frequency; output power; parallel-feedback element; phase noise; pseudomorphic high electron-mobility transistor; resonant frequency; thin-film substrate; Flip-chip; V-band; micromachined cavity; parallel-feedback oscillator; pseudomorphic high electron-mobility transistor (pHEMT); thin-film substrate;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2008.2011334
  • Filename
    4770117