• DocumentCode
    1135335
  • Title

    Enhancement of critical current density and reduction of proximity coupling in fine filamentary NbTi with Si and Mn alloyed Cu matrices

  • Author

    Liu, H. ; Gregory, E. ; Cross, R.W.

  • Author_Institution
    IGC Adv. Superconductors Inc., Waterbury, CT, USA
  • Volume
    30
  • Issue
    4
  • fYear
    1994
  • fDate
    7/1/1994 12:00:00 AM
  • Firstpage
    2304
  • Lastpage
    2307
  • Abstract
    Critical current density Jc and magnetization data are given on fine filamentary NbTi materials with a series of different copper alloy matrices containing Si, Mn, or both. By applying the correct thermomechanical treatment, materials of this type can give high Jc´s with minimal electrical coupling. The use of Si has a particular advantage in that it greatly reduces intermetallic compound formation and may, therefore, obviate the need for a barrier around the filaments under certain conditions
  • Keywords
    copper alloys; critical current density (superconductivity); manganese alloys; niobium alloys; silicon alloys; superconducting cables; titanium alloys; Cu alloy matrices; Cu-Mn; Cu-Mn-Si; Cu-Si; NbTi; critical current density; electrical coupling; fine filamentary NbTi; intermetallic compound formation; proximity coupling; thermomechanical treatment; Billets; Conductors; Copper alloys; Couplings; Critical current density; MONOS devices; Manganese alloys; Niobium compounds; Silicon alloys; Titanium compounds;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/20.305736
  • Filename
    305736