DocumentCode :
1135520
Title :
Impact of Electrode Materials on Resistive-Switching Memory Programming
Author :
Russo, Ugo ; Cagli, Carlo ; Spiga, Sabina ; Cianci, Elena ; Ielmini, Daniele
Author_Institution :
Dipt. di Elettron. e Inf., Politec. di Milano, Milan, Italy
Volume :
30
Issue :
8
fYear :
2009
Firstpage :
817
Lastpage :
819
Abstract :
This letter addresses the impact of electrode materials on programming characteristics of NiO-based resistive-switching memory devices. The use of noble metals for the electrodes, instead of Si contacts, is shown to result in a lowering of the set/reset voltage. This is ascribed to a different chemical composition of the conductive filament (CF) in the set state for varying electrodes, suggesting that atomic diffusion from the electrodes takes place during the formation of the CF at the set process. The results are interpreted on the basis of numerical simulations of the reset transition, which are compared with experimental data.
Keywords :
electric breakdown; elemental semiconductors; nickel compounds; numerical analysis; random-access storage; silicon; NiO; Si; atomic diffusion; conductive filament; electrode materials; numerical simulations; resistive-switching memory devices; resistive-switching memory programming; Dielectric breakdown; electrothermal modeling; nonvolatile memories; resistive-switching memory (RRAM); transition metal oxide;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2009.2025061
Filename :
5165098
Link To Document :
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