A two-step etching technique for silica terraces in the PLC hybrid integration

Author

Young-Tak Han ; Sang-Ho Park ; Shin, J.-U. ; Duk-Jun Kim ; Yoon-Jung Park ; Sung-Woong Park ; Jongdeog Kim ; Hee-Kyung Sung

Author_Institution

Opt. Commun. Devices Res. Dept., Electron. & Telecommun. Res. Inst., Daejeon, South Korea

Volume

16

Issue

11

fYear

2004

Firstpage

2436

Lastpage

2438

Abstract

Two-step etching, after the full processes of a silica waveguide, was performed to fabricate a silica-terraced planar lightwave circuit platform for the hybrid integration of optoelectronic devices. Spot-size converted distributed feedback laser diodes (SSC DFB LDs) were flip-chip bonded on silica terraces with the height accuracy of less than 1 μm, and the resultant coupling loss between the SSC DFB LD and the silica waveguide was about 3.78 dB. The light-current curve of the LD flip-chip bonded on the platform showed the almost linear increase of the output power without any saturation.

Keywords

distributed feedback lasers; etching; flip-chip devices; integrated optoelectronics; optical fabrication; optical losses; optical waveguides; semiconductor lasers; silicon compounds; PLC hybrid integration; SiO/sub 2/; coupling loss; distributed feedback laser diodes; flip-chip bonding; optoelectronic devices; planar lightwave circuit platform; silica terraces; silica waveguide; spot-size conversion; two-step etching; Bonding; Coupling circuits; Diode lasers; Distributed feedback devices; Etching; Optical coupling; Optoelectronic devices; Planar waveguides; Programmable control; Silicon compounds;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2004.835219

Filename

1344059