• DocumentCode
    1135804
  • Title

    Analytical modelling for the RESURF effect in JI and SOI power devices

  • Author

    Popescu, A. ; Udrea, F. ; Ng, R. ; Milne, W.I.

  • Author_Institution
    Dept. of Eng., Cambridge Univ., UK
  • Volume
    149
  • Issue
    56
  • fYear
    2002
  • Firstpage
    273
  • Lastpage
    284
  • Abstract
    The authors present a review and assessment of state-of-the-art analytical models which describe the breakdown behaviour of JI and SOI RESURF power devices. The results are compared with numerical values, and a short evaluation of strengths and weaknesses specific to each model is given. A new modelling concept for the breakdown regime in RESURF power structures is introduced, and the results are assessed against numerical values. The same technique can be used to derive the breakdown voltage of RESURF devices fabricated in JI and SOI technologies, and is potentially useful for non-standard technologies, such as linearly graded SOI, partial SOI and 3-D RESURF. The model provides accurate description for punch-through, non-punch-through and volume breakdown.
  • Keywords
    power MOSFET; power field effect transistors; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; silicon-on-insulator; JI power devices; RESURF effect; SOI power devices; analytical modelling; breakdown behaviour; breakdown voltage; junction-isolated technology; linearly graded SOI; nonpunch-through effects; nonstandard technologies; punch-through effects; volume breakdown;
  • fLanguage
    English
  • Journal_Title
    Circuits, Devices and Systems, IEE Proceedings -
  • Publisher
    iet
  • ISSN
    1350-2409
  • Type

    jour

  • DOI
    10.1049/ip-cds:20020517
  • Filename
    1176567