Title :
Analytical solutions for thermal stresses in buried channel waveguides
Author_Institution :
Dept. of Mech. & Aerosp. Eng., Princeton Univ., NJ, USA
Abstract :
Thermal stresses are important factors in determining the birefringence of optical waveguides. Analytical solutions are developed to estimate the thermal stresses in the core of a buried rectangular channel waveguide. The closed-form solutions for various situations are obtained. The results show that the thermal expansion mismatch between the upper cladding and substrate plays significant role in determining the anisotropy of the thermal stresses in the core. The analytical solutions developed in this paper are consistent with finite element simulations and experimental results.
Keywords :
birefringence; finite element analysis; light polarisation; optical waveguide theory; thermal expansion; thermal stresses; anisotropy; birefringence; buried channel waveguides; closed-form solutions; finite element simulations; optical polarization; optical waveguides; substrate cladding layers; thermal expansion mismatch; thermal stresses; Anisotropic magnetoresistance; Birefringence; Closed-form solution; Finite element methods; Geometrical optics; Optical waveguides; Rectangular waveguides; Thermal expansion; Thermal factors; Thermal stresses; Birefringence; optical polarization; optical waveguides; stress;
Journal_Title :
Quantum Electronics, IEEE Journal of
DOI :
10.1109/JQE.2004.835716
