Analytical solutions for thermal stresses in buried channel waveguides

Author

Huang, M.

Author_Institution

Dept. of Mech. & Aerosp. Eng., Princeton Univ., NJ, USA

Volume

40

Issue

11

fYear

2004

Firstpage

1562

Lastpage

1568

Abstract

Thermal stresses are important factors in determining the birefringence of optical waveguides. Analytical solutions are developed to estimate the thermal stresses in the core of a buried rectangular channel waveguide. The closed-form solutions for various situations are obtained. The results show that the thermal expansion mismatch between the upper cladding and substrate plays significant role in determining the anisotropy of the thermal stresses in the core. The analytical solutions developed in this paper are consistent with finite element simulations and experimental results.

Keywords

birefringence; finite element analysis; light polarisation; optical waveguide theory; thermal expansion; thermal stresses; anisotropy; birefringence; buried channel waveguides; closed-form solutions; finite element simulations; optical polarization; optical waveguides; substrate cladding layers; thermal expansion mismatch; thermal stresses; Anisotropic magnetoresistance; Birefringence; Closed-form solution; Finite element methods; Geometrical optics; Optical waveguides; Rectangular waveguides; Thermal expansion; Thermal factors; Thermal stresses; Birefringence; optical polarization; optical waveguides; stress;

fLanguage

English

Journal_Title

Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

0018-9197

Type

jour

DOI

10.1109/JQE.2004.835716

Filename

1344136