DocumentCode :
1136940
Title :
High-level CAD melds micromachined devices with foundries
Author :
Marshall, J.C. ; Parameswaran, Murali ; Zaghloul, Mona E. ; Gaitan, M.
Author_Institution :
Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
Volume :
8
Issue :
6
fYear :
1992
Firstpage :
10
Lastpage :
17
Abstract :
The use of the Magic technology file to build transducer devices in the form of micro-heaters for use as IR pixels in a thermal display is described. Magic is a high-level computer-aided design (CAD) software system. The design methodology incorporated into the current MOSIS SCMOS technology file for Magic to implement the fabrication of silicon micromachined device structures is presented. This technology file uses only the layers supplied by a commercial standard CMOS process. The main advantages of this technique is that no major equipment is needed and the post-processing is reduced to a single, maskless etch step. The main disadvantage is that custom layers can not be incorporated into the design; therefore, the sensors/transducers can only be composed of polysilicon and/or aluminum sandwiched with thermal oxide and CVD oxide.<>
Keywords :
CAD; electronic engineering computing; elemental semiconductors; semiconductor devices; semiconductor technology; silicon; Al-SiO/sub 2/-Si; CVD oxide; IR pixels; Magic technology file; commercial standard CMOS process; computer-aided design; fabrication; high level CAD; micro-heaters; micromachined devices; polysilicon; software system; technology file; thermal display; thermal oxide; transducer devices; CMOS process; CMOS technology; Computer displays; Design automation; Design methodology; Fabrication; Foundries; Silicon; Software systems; Transducers;
fLanguage :
English
Journal_Title :
Circuits and Devices Magazine, IEEE
Publisher :
ieee
ISSN :
8755-3996
Type :
jour
DOI :
10.1109/101.167507
Filename :
167507
Link To Document :
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