Fiber array-to-photonic-chip fixation and fine tuning using laser support adjustment

Author

Van Zantvoort, Johan H C ; Khoe, Giok-Djan ; De Waardt, Huig

Author_Institution

COBRA Res. Inst., Eindhoven Univ. of Technol., Netherlands

Volume

8

Issue

6

fYear

2002

Firstpage

1331

Lastpage

1340

Abstract

A concept for coupling lensed fiber arrays to photonic optical chips in the submicrometer range by using metal deformation is presented. Fine-tuning is possible despite already secured positions between the parts due to precisely chosen step-by-step deformations in the constructions. The smallest fine-tuning step of 0.1 μm is measured using laser support adjustment. The system is packaged and can be temperature controlled. At a constant chip temperature of 22°C, the package is successfully tested at an ambient temperature range of 0°C to 60°C.

Keywords

integrated circuit packaging; integrated optoelectronics; laser beam welding; lenses; optical arrays; optical fibre couplers; optical planar waveguides; optical tuning; thermal management (packaging); 0 to 60 degC; 22 degC; ambient temperature range; constant chip temperature; fiber array-to-photonic-chip fixation; fine tuning; laser support adjustment; laser welder; lensed fiber array coupling; metal deformation; photonic integrated circuits; photonic optical chips; step-by-step deformations; submicrometer range; temperature controlled packaged system; thermal management; Control systems; Fiber lasers; Laser tuning; Optical arrays; Optical coupling; Optical tuning; Packaging; Semiconductor device measurement; Temperature control; Temperature distribution;

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2002.806688

Filename

1176677