Title :
Wireless Dosimeter: System-on-Chip Versus System-in-Package for Biomedical and Space Applications
Author :
Shamim, Atif ; Arsalan, M. ; Roy, L. ; Shams, M. ; Tarr, G.
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, ON
fDate :
7/1/2008 12:00:00 AM
Abstract :
A new floating-gate (FG) MOSFET based wireless dosimeter system-in-package (SiP) is presented. This miniature and completely integrated wireless dosimeter SiP comprises a CMOS FG radiation sensor and transmitter (TX) in a low-temperature co-fired ceramic (LTCC) package. The design is very well suited to wireless transmission of radiation sensor data in radiotherapy and to Extra Vehicular Activity Radiation Monitoring (EVARM) in space. Two different solutions, namely system-on-chip (SoC) and SiP, are demonstrated. In the SoC, which is size and power efficient, the TX includes an on-chip loop antenna which also acts as the inductor for the VCO resonant tank circuit. The SiP solution has an LTCC antenna with optimized impedance to conjugate match the TX chip. The radiation sensor demonstrates a measured sensitivity of 5 mV/rad. The SoC module size is only 2 mm2, consumes 5.3 mW of power and delivers -0.9 dBm of radiated power, sufficient to communicate with a low noise receiver connected to an off-chip patch antenna placed 1.38 m away. The SiP design provides a larger communication range of 75 m at the cost of additional power consumption and size.
Keywords :
MOSFET; aerospace instrumentation; biomedical telemetry; dosimeters; radiation monitoring; radiation therapy; radiotelemetry; system-in-package; system-on-chip; CMOS floating-gate radiation sensor; biomedical applications; extra vehicular activity radiation monitoring; floating-gate MOSFET; low-temperature co-fired ceramic package; on-chip antenna; radiotherapy; space applications; system-in-package; system-on-chip; wireless dosimeter; Integrated transmitter; low-temperature co-fired ceramic (LTCC); on-chip antenna; system-in-package (SiP); system-on-chip (SoC); wireless dosimeter;
Journal_Title :
Circuits and Systems II: Express Briefs, IEEE Transactions on
DOI :
10.1109/TCSII.2008.921573