Title :
Flip-chip bonding optimizes opto-ICs
Author :
Wale, Michael ; Goodwin, Martin
Abstract :
The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It is argued that the solder-bump technique offers self-alignment, ruggedness, and potentially low manufacturing cost to integrated optics, semiconductor lasers, and optical interconnect devices. Examples of applying flip-chip solder bonding to these devices are presented.<>
Keywords :
flip-chip devices; integrated optics; integrated optoelectronics; microassembling; optical interconnections; semiconductor lasers; soldering; fabrication techniques; flip-chip bonding; hybrid assemblies; integrated optics; optical components; optical interconnect devices; opto-ICs; self-alignment; semiconductor lasers; solder bonding; solder-bump technique; Bonding; Electronic packaging thermal management; Fiber lasers; High speed optical techniques; Integrated optics; Optical devices; Optical fibers; Optical modulation; Optical waveguides; Robotic assembly;
Journal_Title :
Circuits and Devices Magazine, IEEE
