DocumentCode
1137166
Title
Flip-chip bonding optimizes opto-ICs
Author
Wale, Michael ; Goodwin, Martin
Volume
8
Issue
6
fYear
1992
Firstpage
25
Lastpage
31
Abstract
The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It is argued that the solder-bump technique offers self-alignment, ruggedness, and potentially low manufacturing cost to integrated optics, semiconductor lasers, and optical interconnect devices. Examples of applying flip-chip solder bonding to these devices are presented.<>
Keywords
flip-chip devices; integrated optics; integrated optoelectronics; microassembling; optical interconnections; semiconductor lasers; soldering; fabrication techniques; flip-chip bonding; hybrid assemblies; integrated optics; optical components; optical interconnect devices; opto-ICs; self-alignment; semiconductor lasers; solder bonding; solder-bump technique; Bonding; Electronic packaging thermal management; Fiber lasers; High speed optical techniques; Integrated optics; Optical devices; Optical fibers; Optical modulation; Optical waveguides; Robotic assembly;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.167509
Filename
167509
Link To Document