DocumentCode
1137713
Title
The absorption ink transfer mechanism of gravure offset printing for electronic circuitry
Author
Pudas, Marko ; Hagberg, Juha ; Leppävuori, Seppo
Author_Institution
Microelectron. Lab., Univ. of Oulu, Finland
Volume
25
Issue
4
fYear
2002
fDate
10/1/2002 12:00:00 AM
Firstpage
335
Lastpage
343
Abstract
The gravure offset method has been developed toward an industrially viable printing technique for electronic circuitry. In order to obtain the optimum ink resin for printing lines of required thickness (>5 μm) of narrow lines (down to 25 μm), several ink resin systems have been assessed in previous studies by the authors. The best printed results were obtained with a novel ink using a hydrocarbon resin. This ink did not comply with the traditional ink transfer mechanism based on evaporation of the solvent, but with a postulated new "absorption mechanism.".
Keywords
conducting materials; packaging; printing; viscosity; 5 to 25 micron; absorption ink transfer mechanism; absorption mechanism; electronic circuitry; gravure offset printing; hydrocarbon resin; industrially viable printing technique; optimum ink resin; Absorption; Circuits; Conductors; Graphics; Ink; Printing; Production; Resins; Solids; Solvents;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2002.807728
Filename
1176917
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