• DocumentCode
    1137713
  • Title

    The absorption ink transfer mechanism of gravure offset printing for electronic circuitry

  • Author

    Pudas, Marko ; Hagberg, Juha ; Leppävuori, Seppo

  • Author_Institution
    Microelectron. Lab., Univ. of Oulu, Finland
  • Volume
    25
  • Issue
    4
  • fYear
    2002
  • fDate
    10/1/2002 12:00:00 AM
  • Firstpage
    335
  • Lastpage
    343
  • Abstract
    The gravure offset method has been developed toward an industrially viable printing technique for electronic circuitry. In order to obtain the optimum ink resin for printing lines of required thickness (>5 μm) of narrow lines (down to 25 μm), several ink resin systems have been assessed in previous studies by the authors. The best printed results were obtained with a novel ink using a hydrocarbon resin. This ink did not comply with the traditional ink transfer mechanism based on evaporation of the solvent, but with a postulated new "absorption mechanism.".
  • Keywords
    conducting materials; packaging; printing; viscosity; 5 to 25 micron; absorption ink transfer mechanism; absorption mechanism; electronic circuitry; gravure offset printing; hydrocarbon resin; industrially viable printing technique; optimum ink resin; Absorption; Circuits; Conductors; Graphics; Ink; Printing; Production; Resins; Solids; Solvents;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2002.807728
  • Filename
    1176917