Utilizing a low cost 3D packaging technology for consumer applications

Author

Larcombe, Steven P. ; Stern, John M. ; Ivey, Peter A. ; Seed, Luke

Author_Institution

Dept. of Electron. & Electr. Eng., Sheffield Univ., UK

Volume

41

Issue

4

fYear

1995

fDate

11/1/1995 12:00:00 AM

Firstpage

1095

Lastpage

1102

Abstract

This paper demonstrates how a low cost three-dimensional packaging (multichip module-vertical) technology can be utilized to implement systems for consumer applications. In any application where system cost, volume and mass are important, this packaging technique can be advantageous, particularly in the rapidly growing portable electronics industry. To illustrate this we present a general-purpose, low-cost camera and image processing system in the new packaging technology. This can be used in multimedia, surveillance and smart vision applications

Keywords

consumer electronics; image processing; intelligent sensors; multichip modules; multimedia systems; surveillance; video cameras; consumer applications; image processing system; low cost 3D packaging technology; low-cost camera; mass; multichip module-vertical; multimedia applications; portable electronics industry; portable video communicator; smart vision applications; surveillance applications; system cost; volume; Actuators; Consumer electronics; Costs; Electronics industry; Electronics packaging; Fabrication; Intelligent sensors; Power dissipation; Signal processing; Transducers;

fLanguage

English

Journal_Title

Consumer Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0098-3063

Type

jour

DOI

10.1109/30.477228

Filename

477228