Title :
Charging, long-term stability, and TSD measurements of SiO2 electrets
Author_Institution :
Inst. for Electroacoust., Tech. Univ., Darmstadt, West Germany
fDate :
6/1/1989 12:00:00 AM
Abstract :
SiO2 layers with thicknesses of 150 nm, 1 μm, and 2.5 μm were either thermally grown or made by chemical vapor deposition on silicon wafers. Negative and positive charging of the free SiO2 surface was performed by means of liquid-contact, corona, and electron-beam methods. Partially penetrating electrons were used to charge the volume of 2.5-μm-thick SiO2 layers. The good charge stability of negatively charged SiO2 is demonstrated in isothermal measurements at room temperature and at 350°C as well as in TSD experiments. In the isothermal measurements, positively charged samples showed a somewhat faster decay than negatively charged ones. The decay curves of negatively charged samples at elevated temperature can be interpreted with a simple theory based on carrier drift and compensation by conductivity. In the measured TSD spectra, the difference between differently charged samples is that the main peak of a positively charged sample appears at a much lower temperature than the peak of a negatively charged one. Samples positively charged with the corona or liquid contact method also show lower peak performance temperatures than samples positively charged with the electron-beam method
Keywords :
CVD coatings; electrets; insulating thin films; silicon compounds; thermally stimulated currents; Si wafers; TSD spectra; carrier drift; charge stability; chemical vapor deposition; conductivity compensation; corona method; decay curves; electrets; electron-beam method; free SiO2 surface; isothermal measurements; liquid contact method; long-term stability; negatively charged SiO2; peak performance temperatures; positive charging; thermally grown layers; Charge measurement; Chemical vapor deposition; Corona; Current measurement; Electrons; Isothermal processes; Silicon; Stability; Surface charging; Temperature measurement;
Journal_Title :
Electrical Insulation, IEEE Transactions on