• DocumentCode
    1139351
  • Title

    Family-based scheduling rules of a sequence-dependent wafer fabrication system

  • Author

    Chern, Ching-Chin ; Liu, Yu-Lien

  • Author_Institution
    Dept. of Inf. Manage., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    16
  • Issue
    1
  • fYear
    2003
  • fDate
    2/1/2003 12:00:00 AM
  • Firstpage
    15
  • Lastpage
    25
  • Abstract
    Consider the dispatch problem for a wafer fabrication where production process is divided into hundreds of operations and takes a few months to complete. In the process, wafers have to go through similar operations several times repeatedly for different layers of circuit, called job re-entrances. General family-based scheduling rules are proved to perform better than the individual job scheduling rule in terms of machine utilization for multiserver and multiple job re-entrance manufacturing systems under the condition that with a positive possibility, a queue exists in front of steppers. Five special family-based scheduling rules are constructed, of which FCFS-F, SRPT-F, EDD-F, and LS-F are modified from previous well-known scheduling rules, while SDA-F is a rule-based algorithm, using threshold control and least slack principles. A simulation model is built to evaluate the performances of these five family-based rules by using the information collected from a wafer fab located in Hsin-Chu, Taiwan. As a result, SDA-F is shown to perform best among all five rules, followed by LS-F and FCFS-F.
  • Keywords
    integrated circuit manufacture; probability; production control; semiconductor process modelling; EDD-F; FCFS-F; LS-F; SRPT-F; dispatch problem; family-based scheduling rules; job re-entrances; least slack principles; machine utilization; rule-based algorithm; sequence-dependent wafer fabrication system; threshold control; wafer fab; Circuits; Dispatching; Fabrication; Job shop scheduling; Lithography; Manufacturing systems; Performance evaluation; Production systems; Scheduling algorithm; Semiconductor device modeling;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2002.807742
  • Filename
    1177326