DocumentCode :
1139351
Title :
Family-based scheduling rules of a sequence-dependent wafer fabrication system
Author :
Chern, Ching-Chin ; Liu, Yu-Lien
Author_Institution :
Dept. of Inf. Manage., Nat. Taiwan Univ., Taipei, Taiwan
Volume :
16
Issue :
1
fYear :
2003
fDate :
2/1/2003 12:00:00 AM
Firstpage :
15
Lastpage :
25
Abstract :
Consider the dispatch problem for a wafer fabrication where production process is divided into hundreds of operations and takes a few months to complete. In the process, wafers have to go through similar operations several times repeatedly for different layers of circuit, called job re-entrances. General family-based scheduling rules are proved to perform better than the individual job scheduling rule in terms of machine utilization for multiserver and multiple job re-entrance manufacturing systems under the condition that with a positive possibility, a queue exists in front of steppers. Five special family-based scheduling rules are constructed, of which FCFS-F, SRPT-F, EDD-F, and LS-F are modified from previous well-known scheduling rules, while SDA-F is a rule-based algorithm, using threshold control and least slack principles. A simulation model is built to evaluate the performances of these five family-based rules by using the information collected from a wafer fab located in Hsin-Chu, Taiwan. As a result, SDA-F is shown to perform best among all five rules, followed by LS-F and FCFS-F.
Keywords :
integrated circuit manufacture; probability; production control; semiconductor process modelling; EDD-F; FCFS-F; LS-F; SRPT-F; dispatch problem; family-based scheduling rules; job re-entrances; least slack principles; machine utilization; rule-based algorithm; sequence-dependent wafer fabrication system; threshold control; wafer fab; Circuits; Dispatching; Fabrication; Job shop scheduling; Lithography; Manufacturing systems; Performance evaluation; Production systems; Scheduling algorithm; Semiconductor device modeling;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2002.807742
Filename :
1177326
Link To Document :
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