DocumentCode
1139361
Title
On the low-temperature static and dynamic properties of high-performance silicon bipolar transistors
Author
Cressler, John D. ; Tang, Denny D. ; Jenkins, Keith A. ; Li, Guann-Pyng ; Yang, Edward S.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
Volume
36
Issue
8
fYear
1989
fDate
8/1/1989 12:00:00 AM
Firstpage
1489
Lastpage
1502
Abstract
In a study performed over the temperature range of 400 to 77 K, Si bipolar transistors were found to have near-ideal characteristics at low temperatures with β as high as 80 at 77 K. Detailed calculations indicate that the conventional theory of the temperature dependence of β does not match the data. The discrepancy can be removed if it is assumed that a phenomenological thermal barrier to hole injection is present. Emitter-coupled logic (ECL) ring oscillators are functional at 85 K with no degradation in speed until about 165 K when compared to 358 K (85°C). Calculations using a delay figure of merit indicate that f T, R b, and C c are the delay components most affected by low-temperature operation. The feasibility of reduced logic swing operation of bipolar circuits at low temperatures is examined. It is found that successful ECL circuit operation at reduced logic swings is possible provided emitter resistance is kept small and can be used to enhance low-temperature power-delay performance. These data suggest that conventionally designed high-performance bipolar devices are suitable for the low-temperature environment
Keywords
bipolar integrated circuits; bipolar transistors; emitter-coupled logic; low-temperature techniques; semiconductor device testing; 77 to 400 K; ECL ring oscillators; Si bipolar transistors; bipolar circuits; delay figure of merit; dynamic properties; emitter resistance; logic swing operation; low temperatures; near-ideal characteristics; phenomenological thermal barrier; power-delay performance; static properties; temperature dependence; BiCMOS integrated circuits; Bipolar transistors; CMOS technology; Delay; FETs; Logic circuits; Silicon; Temperature dependence; Temperature distribution; Thermal conductivity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.30962
Filename
30962
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