DocumentCode
1139406
Title
Numerical simulation for air flow in the mini-environment and SMIF enclosure
Author
Shiu, Huan-Ruei ; Huang, Hsiao-Yi ; Chen, Sih-Li ; Ke, Ming-Tsun
Author_Institution
Inst. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Volume
16
Issue
1
fYear
2003
fDate
2/1/2003 12:00:00 AM
Firstpage
60
Lastpage
67
Abstract
The application of mini-environment and standard mechanical interface (SMIF) enclosure in the clean room can efficiently reduce airborne particles and isolate the personnel from the product. The purpose of this article is to reduce the recirculation zone and to maintain the positive pressure from the analysis results of the airflow field and pressure distribution of SMIF enclosure and mini-environment. The simulation code CFX will be used to study the flow field of air movement corresponding to the associated design parameters. The results show that proper drilling holes or slots can reduce the circulation zones of SMIF enclosure. The positive pressure of SMIF enclosure is mainly affected by inlet air flux, area of outlets, and leakage area. The calculated results can provide the design rules for SMIF robot inside the SMIF enclosure and reduce the particle accumulation during robot moving.
Keywords
VLSI; clean rooms; computational fluid dynamics; industrial manipulators; process control; semiconductor process modelling; SMIF enclosure; air flow; airborne particles; clean room; design parameters; leakage area; mini-environment; numerical simulation; particle accumulation; pressure distribution; recirculation zone; robot; simulation code; standard mechanical interface; Contamination; Costs; Drilling; Kinetic energy; Manufacturing processes; Numerical simulation; Personnel; Robots; Semiconductor device modeling; Semiconductor process modeling;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2002.807737
Filename
1177331
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