• DocumentCode
    1139406
  • Title

    Numerical simulation for air flow in the mini-environment and SMIF enclosure

  • Author

    Shiu, Huan-Ruei ; Huang, Hsiao-Yi ; Chen, Sih-Li ; Ke, Ming-Tsun

  • Author_Institution
    Inst. of Mech. Eng., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    16
  • Issue
    1
  • fYear
    2003
  • fDate
    2/1/2003 12:00:00 AM
  • Firstpage
    60
  • Lastpage
    67
  • Abstract
    The application of mini-environment and standard mechanical interface (SMIF) enclosure in the clean room can efficiently reduce airborne particles and isolate the personnel from the product. The purpose of this article is to reduce the recirculation zone and to maintain the positive pressure from the analysis results of the airflow field and pressure distribution of SMIF enclosure and mini-environment. The simulation code CFX will be used to study the flow field of air movement corresponding to the associated design parameters. The results show that proper drilling holes or slots can reduce the circulation zones of SMIF enclosure. The positive pressure of SMIF enclosure is mainly affected by inlet air flux, area of outlets, and leakage area. The calculated results can provide the design rules for SMIF robot inside the SMIF enclosure and reduce the particle accumulation during robot moving.
  • Keywords
    VLSI; clean rooms; computational fluid dynamics; industrial manipulators; process control; semiconductor process modelling; SMIF enclosure; air flow; airborne particles; clean room; design parameters; leakage area; mini-environment; numerical simulation; particle accumulation; pressure distribution; recirculation zone; robot; simulation code; standard mechanical interface; Contamination; Costs; Drilling; Kinetic energy; Manufacturing processes; Numerical simulation; Personnel; Robots; Semiconductor device modeling; Semiconductor process modeling;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2002.807737
  • Filename
    1177331