Title :
DBC Technology for Extremely Thin Flat Heat Pipes
Author :
Kamenova, Lora ; Avenas, Yvan ; Schaeffer, Christian ; Tzanova, Slavka ; Kapelski, Georges ; Schulz-Harder, Juergen
Author_Institution :
Grenoble Electr. Eng. Lab., Grenoble Univ., St. Martin d´´Heres, France
Abstract :
This paper presents the concept and experimental demonstration of flat copper heat pipe (HP) embedded in extremely thin 3-D packaging substrates. Since conventional machining for this application is very complicated and expensive, the direct bonded copper (DBC) technology proved to be interesting for mass production. The experimental results demonstrated that the DBC HP is an excellent solution to enhance the heat transfer within the 3-D packaging.
Keywords :
copper; electronics industry; heat pipes; heat transfer; mass production; thermal management (packaging); 3D packaging substrate; DBC technology; direct bonded copper; heat transfer; mass production; thermal packaging; thin flat heat pipe; Direct bonded copper (DBC) technology; experimental results; extremely thin flat heat pipe (HP); mass production;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2009.2027380
