DocumentCode
1139423
Title
DBC Technology for Extremely Thin Flat Heat Pipes
Author
Kamenova, Lora ; Avenas, Yvan ; Schaeffer, Christian ; Tzanova, Slavka ; Kapelski, Georges ; Schulz-Harder, Juergen
Author_Institution
Grenoble Electr. Eng. Lab., Grenoble Univ., St. Martin d´´Heres, France
Volume
45
Issue
5
fYear
2009
Firstpage
1763
Lastpage
1769
Abstract
This paper presents the concept and experimental demonstration of flat copper heat pipe (HP) embedded in extremely thin 3-D packaging substrates. Since conventional machining for this application is very complicated and expensive, the direct bonded copper (DBC) technology proved to be interesting for mass production. The experimental results demonstrated that the DBC HP is an excellent solution to enhance the heat transfer within the 3-D packaging.
Keywords
copper; electronics industry; heat pipes; heat transfer; mass production; thermal management (packaging); 3D packaging substrate; DBC technology; direct bonded copper; heat transfer; mass production; thermal packaging; thin flat heat pipe; Direct bonded copper (DBC) technology; experimental results; extremely thin flat heat pipe (HP); mass production;
fLanguage
English
Journal_Title
Industry Applications, IEEE Transactions on
Publisher
ieee
ISSN
0093-9994
Type
jour
DOI
10.1109/TIA.2009.2027380
Filename
5166464
Link To Document