DocumentCode :
1139755
Title :
Implantation-Free 4H-SiC Bipolar Junction Transistors With Double Base Epilayers
Author :
Jianhui Zhang ; Xueqing Li ; Alexandrov, P. ; Zhao, Jun Hua
Author_Institution :
United Silicon Carbide, Inc., Brunswick
Volume :
29
Issue :
5
fYear :
2008
fDate :
5/1/2008 12:00:00 AM
Firstpage :
471
Lastpage :
473
Abstract :
This letter reports the first 4H-SiC power bipolar junction transistor (BJT) with double base epilayers which is completely free of ion implantation and hence of implantation-induced crystal damages and high-temperature activation annealing-induced surface roughness. Based on this novel design and implantation-free process, a 4H-SiC BJT was fabricated to reach an open base collector-to-emitter blocking voltage of over 1300 V, with a common-emitter current gain up to 31. Improvements on reliability have also been observed, including less forward voltage drift (< 2%) and no significant degradation on current gain in the active region.
Keywords :
power bipolar transistors; silicon compounds; SiC; SiC bipolar junction transistor; collector-to-emitter blocking voltage; double base epilayer; Annealing; Doping; Dry etching; Fabrication; Inductors; Ion implantation; Ohmic contacts; Silicon carbide; Temperature; Voltage; Bipolar junction transistors (BJTs); power transistors; silicon carbide;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.920273
Filename :
4494639
Link To Document :
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