• DocumentCode
    1139755
  • Title

    Implantation-Free 4H-SiC Bipolar Junction Transistors With Double Base Epilayers

  • Author

    Jianhui Zhang ; Xueqing Li ; Alexandrov, P. ; Zhao, Jun Hua

  • Author_Institution
    United Silicon Carbide, Inc., Brunswick
  • Volume
    29
  • Issue
    5
  • fYear
    2008
  • fDate
    5/1/2008 12:00:00 AM
  • Firstpage
    471
  • Lastpage
    473
  • Abstract
    This letter reports the first 4H-SiC power bipolar junction transistor (BJT) with double base epilayers which is completely free of ion implantation and hence of implantation-induced crystal damages and high-temperature activation annealing-induced surface roughness. Based on this novel design and implantation-free process, a 4H-SiC BJT was fabricated to reach an open base collector-to-emitter blocking voltage of over 1300 V, with a common-emitter current gain up to 31. Improvements on reliability have also been observed, including less forward voltage drift (< 2%) and no significant degradation on current gain in the active region.
  • Keywords
    power bipolar transistors; silicon compounds; SiC; SiC bipolar junction transistor; collector-to-emitter blocking voltage; double base epilayer; Annealing; Doping; Dry etching; Fabrication; Inductors; Ion implantation; Ohmic contacts; Silicon carbide; Temperature; Voltage; Bipolar junction transistors (BJTs); power transistors; silicon carbide;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.920273
  • Filename
    4494639