DocumentCode
1140007
Title
Fully Monolithic Cellular Buck Converter Design for 3-D Power Delivery
Author
Sun, Jian ; Giuliano, David ; Devarajan, Siddharth ; Lu, Jian-Qiang ; Chow, T. Paul ; Gutmann, Ronald J.
Author_Institution
Rensselaer Polytech. Inst., Troy, NY
Volume
17
Issue
3
fYear
2009
fDate
3/1/2009 12:00:00 AM
Firstpage
447
Lastpage
451
Abstract
A fully monolithic interleaved buck dc-dc point-of-load (PoL) converter has been designed and fabricated in a 0.18-mm SiGe BiCMOS process. Target application of the design is 3-D power delivery for future microprocessors, in which the PoL converter will be vertically integrated with the processor using wafer-level 3-D interconnect technologies. Advantages of 3-D power delivery over conventional discrete voltage regulator modules (VRMs) are discussed. The prototype design, using two interleaved buck converter cells each operating at 200 MHz switching frequency and delivering 500 mA output current, is discussed with a focus on the converter power stage and control loop to highlight the tradeoffs unique to such high-frequency, monolithic designs. Measured steady-state and dynamic responses of the fabricated prototype are presented to demonstrate the ability of such monolithic converters to meet the power delivery requirements of future processors.
Keywords
BiCMOS integrated circuits; DC-DC power convertors; Ge-Si alloys; integrated circuit interconnections; microprocessor chips; voltage regulators; 3D power delivery; BiCMOS process; SiGe; dc-dc point-of-load converter; microprocessors; monolithic cellular buck converter; size 0.18 mm; voltage regulator modules; wafer-level 3D interconnect; 3-D integration; dc-to-dc converters; monolithic power conversion; power delivery; power management; voltage regulator;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2008.2005312
Filename
4773147
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