DocumentCode
1140179
Title
A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate
Author
Liang, Yung C. ; Zeng, Wenjiang ; Ong, Pick Hong ; Gao, Zhaoxia ; Cai, Jun ; Balasubramanian, N.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, CA, USA
Volume
23
Issue
12
fYear
2002
Firstpage
700
Lastpage
703
Abstract
In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology.
Keywords
elemental semiconductors; inductors; integrated circuit technology; micromechanical devices; radiofrequency integrated circuits; silicon; system-on-chip; MEMS; RFIC; SOC; Si; process technology; suspended radio frequency micro-inductors; trench depth; Couplings; Dielectric substrates; Fabrication; Geometry; Lithography; Radio frequency; Radiofrequency integrated circuits; Silicon; System-on-a-chip; Transformers;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2002.805748
Filename
1177953
Link To Document