DocumentCode :
1140276
Title :
SiGe Radio Frequency ICs for Low-Power Portable Communication
Author :
Long, John R.
Author_Institution :
Electron. Res. Lab./DIMES, Delft Univ. of Technol., Netherlands
Volume :
93
Issue :
9
fYear :
2005
Firstpage :
1598
Lastpage :
1623
Abstract :
The range and impact of SiGe bipolar and BiCMOS technologies on wireless transceivers for portable telephony and data communications are surveyed. SiGe technology enables transceiver designs that compare favorably with competing technologies such as RF CMOS or III-Vs, with advantages in design cycle time and performance versus cost. As wireless devices continue to increase in complexity using conventional battery technology as the power source, the desire to reduce current consumption in future transceivers continues to favor SiGe technology. Examples are drawn from contemporary wireless communications ICs. The performance of on-chip passive components in silicon technologies are also reviewed in this paper. Greater understanding of the limitations of passive devices coupled with improved models for their performance are leading to circuits offering wider RF dynamic range at ever higher operating frequencies. The innovations in on-chip passive design and construction currently being pioneered in mixed-signal SiGe technologies are enabling circuits operating deep into millimeter-wave frequency bands (i.e., well above 30 GHz). In addition, sophisticated on-chip magnetic components combined with deep submicrometer SiGe active devices in a transceiver front end are envisioned that enable single-volt SiGe circuits, with even lower current consumption than is achievable today. Relevant examples from the recent literature are presented.
Keywords :
BiCMOS integrated circuits; Ge-Si alloys; bipolar integrated circuits; low-power electronics; mixed analogue-digital integrated circuits; mobile handsets; radiofrequency integrated circuits; transceivers; BiCMOS technologies; RF CMOS; SiGe; active devices; battery technology; bipolar technology; current consumption; data communications; low-power portable communication; millimeter-wave frequency bands; mixed-signal integrated circuit; on-chip magnetic components; on-chip passive components; portable telephony; radio frequency integrated circuit; silicon technologies; transceiver front end; wireless communication transceivers; BiCMOS integrated circuits; CMOS technology; Data communication; Germanium silicon alloys; III-V semiconductor materials; Millimeter wave technology; Radio frequency; Silicon germanium; Telephony; Transceivers; Coplanar waveguide; injection locking; integrated circuits (ICs); low-noise amplifier (LNA); microstrip; millimeter wave; mixer; monolithic inductor; radio frequency; slow wave; transformer; transmission line; voltage-controlled oscillator (VCO); wireless communication transceivers;
fLanguage :
English
Journal_Title :
Proceedings of the IEEE
Publisher :
ieee
ISSN :
0018-9219
Type :
jour
DOI :
10.1109/JPROC.2005.852227
Filename :
1495908
Link To Document :
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