• DocumentCode
    1140511
  • Title

    A High Density Programmable Logic Array Chip

  • Author

    Wood, Roy A.

  • Author_Institution
    IBM Corporation, System Communications Division
  • Issue
    9
  • fYear
    1979
  • Firstpage
    602
  • Lastpage
    608
  • Abstract
    A programmable logic array (PLA) chip design using special array folding techniques and an on-chip bus structure has been developed. It overcomes the sparseness in conventional large PLA configurations. The design is a masterslice FET chip personalized for the particular application during processing. Software algorithms are used to map conventional PLA formats into the new structure. The techniques used provide improved logic function and performance for an FET array technology. Included are descriptions of the PLA architecture and the circuitry that was used.
  • Keywords
    Array folding techniques; array logic; array optimization; folded array configuration; programmable logic array (PLA); Application software; Chip scale packaging; Circuits; Computer architecture; FETs; Logic arrays; Logic design; Logic functions; Programmable logic arrays; Software algorithms; Array folding techniques; array logic; array optimization; folded array configuration; programmable logic array (PLA);
  • fLanguage
    English
  • Journal_Title
    Computers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9340
  • Type

    jour

  • DOI
    10.1109/TC.1979.1675427
  • Filename
    1675427