DocumentCode
1140511
Title
A High Density Programmable Logic Array Chip
Author
Wood, Roy A.
Author_Institution
IBM Corporation, System Communications Division
Issue
9
fYear
1979
Firstpage
602
Lastpage
608
Abstract
A programmable logic array (PLA) chip design using special array folding techniques and an on-chip bus structure has been developed. It overcomes the sparseness in conventional large PLA configurations. The design is a masterslice FET chip personalized for the particular application during processing. Software algorithms are used to map conventional PLA formats into the new structure. The techniques used provide improved logic function and performance for an FET array technology. Included are descriptions of the PLA architecture and the circuitry that was used.
Keywords
Array folding techniques; array logic; array optimization; folded array configuration; programmable logic array (PLA); Application software; Chip scale packaging; Circuits; Computer architecture; FETs; Logic arrays; Logic design; Logic functions; Programmable logic arrays; Software algorithms; Array folding techniques; array logic; array optimization; folded array configuration; programmable logic array (PLA);
fLanguage
English
Journal_Title
Computers, IEEE Transactions on
Publisher
ieee
ISSN
0018-9340
Type
jour
DOI
10.1109/TC.1979.1675427
Filename
1675427
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