DocumentCode
1140515
Title
Closed-form analytical drain current model considering energy transport and self-heating for short-channel fully-depleted SOI NMOS devices with lightly-doped drain structure biased in strong inversion
Author
Lin, Shih-Chia ; Kuo, James B.
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Ont., Canada
Volume
49
Issue
12
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
2193
Lastpage
2203
Abstract
This paper reports a closed-form analytical drain current model considering energy transport and self-heating for short-channel fully-depleted (FD) SOI NMOS devices with lightly-doped drain (LDD) structure. As verified by the two-dimensional (2-D) simulation results, the analytical drain current model considering energy transport and self-heating provides an accurate prediction of the drain current behavior of the 0.25-μm FD SOI NMOS device with and without an LDD structure. From the analytical model, with the LDD structure, the device has a smaller effective electron mobility at a low drain voltage, where lattice temperature is dominant, and a higher effective mobility at a high drain voltage, where electron temperature dominates, as compared to the non-LDD device.
Keywords
MOSFET; electron mobility; semiconductor device models; silicon-on-insulator; 0.25 micron; closed-form analytical drain current model; electron mobility; energy transport; inversion bias; lightly-doped drain structure; self-heating; short-channel fully-depleted SOI NMOS device; two-dimensional simulation; Analytical models; Electron mobility; Equations; Isolation technology; Lattices; Low voltage; MOS devices; Predictive models; Temperature; Very large scale integration;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2002.805222
Filename
1177984
Link To Document