DocumentCode
1140556
Title
Multiple-gate SOI MOSFETs: device design guidelines
Author
Park, Jong-Tae ; Colinge, Jean-Pierre
Author_Institution
Deptartment of Electron. Eng., Univ. of Incheon, South Korea
Volume
49
Issue
12
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
2222
Lastpage
2229
Abstract
This paper describes computer simulations of various SOI MOSFETs with double and triple-gate structures, as well as gate-all-around devices. The concept of a triple-gate device with sidewalls extending into the buried oxide (hereby called a "Π-gate" or "Pi-gate" MOSFET) is introduced. The Pi-gate device is simple to manufacture and offers electrical characteristics similar to the much harder to fabricate gate-all-around MOSFET. To explore the optimum design space for four different gate structures, simulations were performed with four variable device parameters: gate length, channel width, doping concentration, and silicon film thickness. The efficiency of the different gate structures is shown to be dependent of these parameters. The simulation results indicate that the the Pi-gate device is a very promising candidate for future nanometer MOSFET applications.
Keywords
MOSFET; semiconductor device models; silicon-on-insulator; Pi-gate device; buried oxide; computer simulation; device design; double-gate structure; electrical characteristics; gate-all-around device; multiple-gate SOI MOSFET; triple-gate structure; CMOS process; Computer simulation; Degradation; Doping; Electric variables; Guidelines; MOSFETs; Manufacturing processes; Semiconductor films; Silicon on insulator technology;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2002.805634
Filename
1177988
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