• DocumentCode
    1140556
  • Title

    Multiple-gate SOI MOSFETs: device design guidelines

  • Author

    Park, Jong-Tae ; Colinge, Jean-Pierre

  • Author_Institution
    Deptartment of Electron. Eng., Univ. of Incheon, South Korea
  • Volume
    49
  • Issue
    12
  • fYear
    2002
  • fDate
    12/1/2002 12:00:00 AM
  • Firstpage
    2222
  • Lastpage
    2229
  • Abstract
    This paper describes computer simulations of various SOI MOSFETs with double and triple-gate structures, as well as gate-all-around devices. The concept of a triple-gate device with sidewalls extending into the buried oxide (hereby called a "Π-gate" or "Pi-gate" MOSFET) is introduced. The Pi-gate device is simple to manufacture and offers electrical characteristics similar to the much harder to fabricate gate-all-around MOSFET. To explore the optimum design space for four different gate structures, simulations were performed with four variable device parameters: gate length, channel width, doping concentration, and silicon film thickness. The efficiency of the different gate structures is shown to be dependent of these parameters. The simulation results indicate that the the Pi-gate device is a very promising candidate for future nanometer MOSFET applications.
  • Keywords
    MOSFET; semiconductor device models; silicon-on-insulator; Pi-gate device; buried oxide; computer simulation; device design; double-gate structure; electrical characteristics; gate-all-around device; multiple-gate SOI MOSFET; triple-gate structure; CMOS process; Computer simulation; Degradation; Doping; Electric variables; Guidelines; MOSFETs; Manufacturing processes; Semiconductor films; Silicon on insulator technology;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2002.805634
  • Filename
    1177988