DocumentCode :
1141158
Title :
Considerations in the Design of Bond Straps
Author :
Craft, Arnold M.
Volume :
6
Issue :
3
fYear :
1964
Firstpage :
58
Lastpage :
65
Abstract :
The concept of a bond strap is discussed along with the significant parameters involved in its design. A logical approach to design is given along with formulas that may be used to approximate the bond parameters. Several calculations are included to show orders of magnitude that may be expected for R, L, and C, in addition to impedance, at frequencies up to 1 Gc. A summary table shows the effects of increases in basic parameter values versus dimensional variations.
Keywords :
Bonding; Conductivity; Copper; Electrical safety; Frequency; Impedance; Silver; Solids; Springs; Writing;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.1964.4307363
Filename :
4307363
Link To Document :
بازگشت