DocumentCode
1141158
Title
Considerations in the Design of Bond Straps
Author
Craft, Arnold M.
Volume
6
Issue
3
fYear
1964
Firstpage
58
Lastpage
65
Abstract
The concept of a bond strap is discussed along with the significant parameters involved in its design. A logical approach to design is given along with formulas that may be used to approximate the bond parameters. Several calculations are included to show orders of magnitude that may be expected for R, L, and C, in addition to impedance, at frequencies up to 1 Gc. A summary table shows the effects of increases in basic parameter values versus dimensional variations.
Keywords
Bonding; Conductivity; Copper; Electrical safety; Frequency; Impedance; Silver; Solids; Springs; Writing;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.1964.4307363
Filename
4307363
Link To Document