Title :
Considerations in the Design of Bond Straps
Author :
Craft, Arnold M.
Abstract :
The concept of a bond strap is discussed along with the significant parameters involved in its design. A logical approach to design is given along with formulas that may be used to approximate the bond parameters. Several calculations are included to show orders of magnitude that may be expected for R, L, and C, in addition to impedance, at frequencies up to 1 Gc. A summary table shows the effects of increases in basic parameter values versus dimensional variations.
Keywords :
Bonding; Conductivity; Copper; Electrical safety; Frequency; Impedance; Silver; Solids; Springs; Writing;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.1964.4307363