• DocumentCode
    1142298
  • Title

    An automated electrical defect identification and location method for CMOS processes using a specially designed test chip

  • Author

    Comeau, Alain R. ; Laneuville, Jacques

  • Author_Institution
    MITEL Semicond., Bromont, Que., Canada
  • Volume
    5
  • Issue
    3
  • fYear
    1992
  • fDate
    8/1/1992 12:00:00 AM
  • Firstpage
    207
  • Lastpage
    213
  • Abstract
    A test chip (named Yieldchip) was designed, simulated, fabricated, and tested on a 3-μm process. The layout of the Yieldchip´s cells enables the test program to electrically locate and identify active faults, thereby automating the, classification of defects. The Yieldchip can detect more than one defect per circuit in most circumstances. The algorithm can identify the 21 simple defects of the cells and can be used as an expert system to extend this list. Unidentified detectable faults are flagged at all times and located if possible
  • Keywords
    CMOS integrated circuits; automatic testing; circuit analysis computing; expert systems; fault location; integrated circuit testing; 3 micron; CMOS processes; Yieldchip; algorithm; automated electrical defect identification; defect location; expert system; test chip; Automatic testing; CMOS process; Circuit faults; Circuit testing; Fault diagnosis; Inverters; Monitoring; Performance evaluation; Semiconductor device measurement; Semiconductor device modeling;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.149803
  • Filename
    149803