DocumentCode :
1142662
Title :
Comb Capacitor Structures for On-Chip Physical Uncloneable Function
Author :
Roy, Deepu ; Klootwijk, Johan H. ; Verhaegh, Nynke A M ; Roosen, Harold H A J ; Wolters, Rob A M
Author_Institution :
NXP Semicond. Res., Eindhoven, Netherlands
Volume :
22
Issue :
1
fYear :
2009
Firstpage :
96
Lastpage :
102
Abstract :
Planar inter-digitated comb capacitor structures are an excellent tool for on-chip capacitance measurement and evaluation of properties of coating layers with varying composition. These comb structures are easily fabricated in a single step in the last metallization layer of a standard IC process. Capacitive coupling of these structures with a coating layer is modelled based on the electric field distribution to have a detailed understanding of contributing capacitance components. The coating composition is optimized to provide maximum spread in capacitance values of comb capacitor structures. This spread in measured capacitance values can be used to implement a physical uncloneable function (PUF). A PUF is a random function which can be evaluated only with the help of a physical system. We present an on-chip capacitive PUF for chip security and data storage in which the unlock key algorithm is generated from capacitors which are physically linked to the chip in an inseparable way. The strength of this key increases with the spread in capacitance values and measurement accuracy.
Keywords :
capacitance; capacitor storage; capacitors; coatings; integrated circuit metallisation; security of data; capacitive coupling; coating layer; data storage; electric field distribution; on-chip physical uncloneable function; planar inter-digitated comb capacitor structures; random function; unlock key algorithm; Capacitance measurement; Capacitors; Coatings; Data security; Dielectric measurements; Information security; Memory; Metallization; Semiconductor device measurement; Smart cards; Comb capacitors; physical uncloneable function (PUF); postprocessing; security coating;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2008.2010738
Filename :
4773489
Link To Document :
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