Title :
Long-Range Lateral Dopant Diffusion in Tungsten Silicide Layers
Author :
Liao, Shengzhou ; Bain, Mike ; Baine, Paul ; McNeill, David W. ; Armstrong, B. Mervyn ; Gamble, Harold S.
Author_Institution :
Northern Ireland Semicond. Res. Centre, Queen´´s Univ., Belfast
Abstract :
Novel diode test structures have been manufactured to characterize long-range dopant diffusion in tungsten silicide layers. A tungsten silicide to p-type silicon contact has been characterized as a Schottky barrier rectifying contact with a silicide work function of 4.8 eV. Long-range diffusion of boron for an anneal at 900degC for 30 min has been shown to alter this contact to become ohmic. Long-range diffusion of phosphorus with a similar anneal alters the contact to become a bipolar n-p diode. Bipolar diode action is demonstrated experimentally for anneal schedules of 30 min at 900deg C, indicating long-range diffusion of phosphorus ( ~ 38 mum). SIMS analysis shows dopant redistribution is adversely affected by segregation to the silicide/oxide interface. The concept of conduit diffusion has been demonstrated experimentally for application in advanced bipolar transistor technology.
Keywords :
Schottky barriers; Schottky diodes; annealing; bipolar transistors; boron; ohmic contacts; phosphorus; rectification; secondary ion mass spectra; segregation; semiconductor doping; semiconductor materials; tungsten compounds; work function; SIMS; Schottky barrier rectifying contact; Si-WSi:B; Si-WSi:P; annealing; bipolar n-p diode; bipolar transistor; diode test structures; long-range lateral dopant diffusion; segregation; temperature 900 degC; time 30 min; work function; Annealing; Boron; Job shop scheduling; Manufacturing; Schottky barriers; Schottky diodes; Silicides; Silicon; Testing; Tungsten; Diffusion processes; diodes; doping; tungsten compounds;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
DOI :
10.1109/TSM.2008.2010734