Title :
Analysis of microwave capacitors and IC packages
Author :
Beker, Benjamin ; Cokkinides, George ; Templeton, Allen
Author_Institution :
Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA
fDate :
9/1/1994 12:00:00 AM
Abstract :
This paper presents quasi-static electromagnetic (EM) models for analysis and design of microwave capacitors and integrated circuit (IC) packages. The theoretical background for modeling of open 3-D boundaries with finite difference method (FDM) is reviewed and the use of current simulation method (CSM) for inductance computation is proposed. Computed data for the capacitance and inductance of capacitors with complex three-dimensional geometries are verified both numerically and experimentally, validating the proposed quasi-static models. Numerical results for practical devices and IC packages are also given
Keywords :
capacitance; capacitors; finite difference methods; inductance; microwave integrated circuits; packaging; current simulation method; finite difference method; inductance computation; microwave IC packages; microwave capacitors; open 3D boundaries; quasi-static electromagnetic models; three-dimensional geometries; Capacitors; Circuit simulation; Computational modeling; Electromagnetic analysis; Electromagnetic modeling; Finite difference methods; Inductance; Integrated circuit modeling; Integrated circuit packaging; Microwave integrated circuits;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
