Analysis of microwave capacitors and IC packages

Author

Beker, Benjamin ; Cokkinides, George ; Templeton, Allen

Author_Institution

Dept. of Electr. & Comput. Eng., South Carolina Univ., Columbia, SC, USA

Volume

42

Issue

9

fYear

1994

fDate

9/1/1994 12:00:00 AM

Firstpage

1759

Lastpage

1764

Abstract

This paper presents quasi-static electromagnetic (EM) models for analysis and design of microwave capacitors and integrated circuit (IC) packages. The theoretical background for modeling of open 3-D boundaries with finite difference method (FDM) is reviewed and the use of current simulation method (CSM) for inductance computation is proposed. Computed data for the capacitance and inductance of capacitors with complex three-dimensional geometries are verified both numerically and experimentally, validating the proposed quasi-static models. Numerical results for practical devices and IC packages are also given

Keywords

capacitance; capacitors; finite difference methods; inductance; microwave integrated circuits; packaging; current simulation method; finite difference method; inductance computation; microwave IC packages; microwave capacitors; open 3D boundaries; quasi-static electromagnetic models; three-dimensional geometries; Capacitors; Circuit simulation; Computational modeling; Electromagnetic analysis; Electromagnetic modeling; Finite difference methods; Inductance; Integrated circuit modeling; Integrated circuit packaging; Microwave integrated circuits;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.310585

Filename

310585