Analysis of packaged microwave integrated circuits by FDTD

Author

Mezzanotte, Paolo ; Mongiardo, Mauro ; Roselli, Luca ; Sorrentino, Roberto ; Heinrich, Wolfgang

Author_Institution

Istituto di Elettronica, Perugia Univ., Italy

Volume

42

Issue

9

fYear

1994

fDate

9/1/1994 12:00:00 AM

Firstpage

1796

Lastpage

1801

Abstract

The behavior of packaged single and coupled MMIC via-hole grounds has been investigated by using a graded mesh FDTD code running on the massive parallel computer DEC 12000 with 4 K processors. Theoretical simulations have been compared with experimental measurements showing excellent agreement. Moreover, since the package introduces resonances, we have also investigated several different possibilities to choke off these resonances. It is shown that the common practice of inserting a damping layer just below the lid is often not effective. In particular, the importance of placing damping layers also on the side walls is demonstrated

Keywords

MMIC; circuit analysis computing; finite difference time-domain analysis; microstrip components; packaging; parallel algorithms; resonance; DEC 12000; MMIC; damping layers; graded mesh FDTD code; massive parallel computer; packaged microwave integrated circuits; resonances; simulation; via-hole grounds; Computational modeling; Concurrent computing; Coupling circuits; Damping; Finite difference methods; Integrated circuit packaging; MMICs; Microwave integrated circuits; Resonance; Time domain analysis;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.310590

Filename

310590