• DocumentCode
    1143315
  • Title

    Electromagnetically Driven Expanding Ring With Preheating

  • Author

    Landen, Dwight ; Wetz, David ; Satapathy, Sikhanda ; Levinson, Scott

  • Author_Institution
    Inst. for Adv. Technol., Univ. of Texas, Austin, TX
  • Volume
    45
  • Issue
    1
  • fYear
    2009
  • Firstpage
    598
  • Lastpage
    603
  • Abstract
    Experiments were conducted that simulate the time-varying mechanical and thermal conditions typically found in electromagnetic launchers. While materials that are slowly heated isothermally have adequate time for fundamental microstructural changes that weaken them to occur, the mechanical strength of metals subjected to rapidly varying high-temperature pulses is dependent on heating rate and duration. Previous work has shown that tabulated properties of high-temperature materials inadequately describe such materials under pulsed heating conditions. In this paper, electrolytic tough pitch copper ring samples have been heated to a peak temperature in the range of 450degC over about 25 ms. The samples are first inductively preheated with low current before using a short-duration high-current pulse to expand the ring. A new photonic Doppler velocimetry system was used to accurately measure the velocity profile during the dynamic thermal and mechanical conditions. Preheating the specimens to 200degC resulted in a 30% drop in strength when compared to samples without preheating.
  • Keywords
    electromagnetic launchers; induction heating; mechanical strength; rings (structures); electrolytic tough pitch copper ring samples; electromagnetic launchers; electromagnetically driven expanding ring; high-temperature materials; mechanical strength; photonic Doppler velocimetry system; pulsed heating conditions; temperature 200 degC; time-varying mechanical conditions; time-varying thermal conditions; velocity profile; Expanding ring; photonic doppler velocimetry (PDV); pulsed adiabatic conditions;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2008.2008567
  • Filename
    4773547