DocumentCode :
1144031
Title :
Enhanced electronic system reliability - challenges for temperature prediction
Author :
Parry, John D. ; Rantala, Jukka ; Lasance, Clemens J M
Volume :
25
Issue :
4
fYear :
2002
fDate :
12/1/2002 12:00:00 AM
Firstpage :
533
Lastpage :
538
Abstract :
Using telecommunication as an example, it is argued that the electronics industry badly needs a change in attitude toward reliability thinking. The role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies. Current and future practices are discussed in the context of newly-emerging reliability standards. Finally, two multi-company projects targeting the improvement of reliability through better temperature-related information are described.
Keywords :
design engineering; electronics industry; reliability; standards; electronic system reliability; electronics industry; multi-company projects; reliability qualification; reliability standards; short design cycles; temperature prediction; thermal design; Associate members; Circuit testing; Computer industry; Costs; Electronics industry; Laboratories; Mobile handsets; Qualifications; Telecommunication network reliability; Temperature;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2002.808001
Filename :
1178741
Link To Document :
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