DocumentCode
1144040
Title
Increasing the accuracy of thermal transient measurements
Author
Székely, Vladimir ; Rencz, Márta
Author_Institution
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Hungary
Volume
25
Issue
4
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
539
Lastpage
546
Abstract
Recent developments in the methodology of thermal transient measurements and evaluation are discussed in the paper. All of them are aimed at increasing the accuracy of these measurements and their evaluation. After a short summary of the evaluation methodology a procedure is presented for the correction of the nonconstant powering. New methods are presented for the compensation, evaluation and modeling of the nonlinearities. Various aspects of pulsed powering are discussed in detail.
Keywords
compensation; packaging; thermal analysis; thermal resistance; transient analysis; compensation; evaluation methodology; measurement evaluation; nonconstant powering; nonlinearities; package qualification; pulsed powering; thermal transient measurements; Capacitance; Electrical resistance measurement; Heating; Packaging; Pulse measurements; Semiconductor device measurement; Temperature dependence; Temperature sensors; Testing; Thermal resistance;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.808002
Filename
1178742
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