Title :
Increasing the accuracy of thermal transient measurements
Author :
Székely, Vladimir ; Rencz, Márta
Author_Institution :
Dept. of Electron Devices, Budapest Univ. of Technol. & Econ., Hungary
fDate :
12/1/2002 12:00:00 AM
Abstract :
Recent developments in the methodology of thermal transient measurements and evaluation are discussed in the paper. All of them are aimed at increasing the accuracy of these measurements and their evaluation. After a short summary of the evaluation methodology a procedure is presented for the correction of the nonconstant powering. New methods are presented for the compensation, evaluation and modeling of the nonlinearities. Various aspects of pulsed powering are discussed in detail.
Keywords :
compensation; packaging; thermal analysis; thermal resistance; transient analysis; compensation; evaluation methodology; measurement evaluation; nonconstant powering; nonlinearities; package qualification; pulsed powering; thermal transient measurements; Capacitance; Electrical resistance measurement; Heating; Packaging; Pulse measurements; Semiconductor device measurement; Temperature dependence; Temperature sensors; Testing; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2002.808002
