Title :
Foreword contributions from thermal challenges in next generation electronic systems (THERMES)
Author :
Garimella, Suresh V. ; Joshi, Yogendra K.
Author_Institution :
Purdue University
Keywords :
Consumer electronics; Electronic packaging thermal management; Electronics cooling; Heat transfer; Mechanical engineering; Product development; Resource management; Thermal loading; Thermal management; Thermal management of electronics;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2002.807992
