Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

Author

Garimella, Suresh V. ; Joshi, Yogendra K. ; Bar-Cohen, Avram ; Mahajan, Ravi ; Toh, K.C. ; Carey, V.P. ; Baelmans, M. ; Lohan, J. ; Sammakia, B. ; Andros, F.

Author_Institution

Purdue Univ., West Lafayette, IN, USA

Volume

25

Issue

4

fYear

2002

fDate

12/1/2002 12:00:00 AM

Firstpage

569

Lastpage

575

Abstract

The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and Internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.

Keywords

cooling; technological forecasting; thermal management (packaging); THERMES; computing architectures; electronic packages; microscale cooling systems; next generation electronic systems; numerical modeling; research community; thermal management roadmaps; transport issues; Computer aided manufacturing; Computer architecture; Electronic packaging thermal management; Electronics cooling; Hardware; High performance computing; Internet; Numerical models; Thermal management; Thermal management of electronics;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2003.809113

Filename

1178748