Title :
Remote heat sink concept for high power heat rejection
Author :
Webb, Ralph L. ; Yamauchi, Shinobu ; Denko, S. ; Tochigi, K.K.
Author_Institution :
Dept. of Mech. Eng., Penn State Univ., University Park, PA, USA
fDate :
12/1/2002 12:00:00 AM
Abstract :
This paper addresses heat rejection concepts intended to reject 100 W (or more) from the CPU of a desktop computer or server. A high-performance, air-cooled thermo-syphon heat rejection system is described that meets the goal. This concept is believed to represent the highest performance that has been reported for an air-cooled heat rejection system. A working fluid is boiled in a small chamber mounted on the CPU, and the vapor is condensed in the tubes of the remotely located air-cooled condenser. The air-cooled heat exchanger provides much higher performance than is obtainable with conventional "round-tube" technology. The boiling design is compared with other systems that have been proposed, e.g., liquid or two-phase cooling in micro-channels, and is shown to provide better performance. The heat exchange technology may also be applied to refrigerated cooling.
Keywords :
cooling; heat exchangers; heat sinks; microprocessor chips; thermal management (packaging); thermal resistance; 100 W; air-cooled heat exchanger; air-cooled thermo-syphon system; boiling design; desktop computer CPU; high power heat rejection; refrigerated cooling; remote heat sink technology; remotely located air-cooled condenser; server CPU; thermal resistance; Central Processing Unit; Cooling; Copper; Heat sinks; Heat transfer; Refrigeration; Resistance heating; Surface resistance; Temperature; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.809109