DocumentCode
1144276
Title
Advanced thermal architecture for cooling of high power electronics
Author
Zuo, Zhijun ; Hoover, L.R. ; Phillips, A.L.
Author_Institution
Thermacore Int. Inc., Lancaster, PA, USA
Volume
25
Issue
4
fYear
2002
fDate
12/1/2002 12:00:00 AM
Firstpage
629
Lastpage
634
Abstract
This paper presents a thermal architecture concept for analysis of thermal problems and solutions existing in electronics systems. The thermal problems are categorized into a total of seven levels from chip to system. Advanced thermal technologies for addressing the thermal problems at all seven levels are discussed. Integrating the thermal architecture with the electronic architecture can significantly improve the effectiveness of the thermal management.
Keywords
cooling; thermal analysis; thermal management (packaging); advanced thermal architecture; electronics cooling; high power electronics; Computer architecture; Electronic packaging thermal management; Electronics cooling; Integrated circuit interconnections; Microprocessors; Power system reliability; Refrigeration; Temperature; Thermal management; Thermal management of electronics;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2002.807995
Filename
1178762
Link To Document