DocumentCode
1144866
Title
Design, Fabrication, and Characterization of Flip-Chip Bonded Microinductors
Author
Flynn, David ; Desmulliez, Marc P Y
Author_Institution
Sch. of Eng. & Phys. Sci., Heriot-Watt Univ., Edinburgh, UK
Volume
45
Issue
8
fYear
2009
Firstpage
3055
Lastpage
3063
Abstract
Magnetic core materials of higher performance than ferrite materials in the 0.5-10 MHz frequency range are investigated. The performance characteristics of electrodeposited nickel-iron, cobalt-iron-copper alloys, and the commercial alloy Vitrovac 6025 have been assessed through their inclusion within a custom made solenoid micro-inductor. Inductance values ranging from 0.3 to 120 muH with component power efficiency above 90% have been measured. Two highly laminated prototypes consisting of 70 and 105 laminates of 5 mum thick nickel-iron have achieved a power output efficiency of 92% at 0.5 MHz with power densities of 33 and 49 W/cm3 , respectively. A design methodology based on material properties and device specifications is proposed for the manufacture of performant microinductors. Issues surrounding micro-inductor design and performance are discussed.
Keywords
electrodeposition; flip-chip devices; inductors; magnetic cores; solenoids; CoFeCo; NiFe; Vitrovac 6025; cobalt-iron-copper alloys; electrodeposition; flip-chip bonded microinductors; frequency 0.5 MHz to 10 MHz; magnetic core materials; nickel-iron; solenoid microinductor; DC-DC power conversion; electrodeposition; magnetic films; microinductor;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/TMAG.2009.2016558
Filename
5170214
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