Analysis of a thermally enhanced ball grid array package

Author

Guenin, Bruce M. ; Marrs, Robert C. ; Molnar, Ronald J.

Author_Institution

Adv. Products Operation, Amkor Electron. Inc., Chandler, AZ, USA

Volume

18

Issue

4

fYear

1995

fDate

12/1/1995 12:00:00 AM

Firstpage

749

Lastpage

757

Abstract

A thermally enhanced ball grid array package (SuperBGA package) has been developed. Its thermal performance has been analyzed using a nonlinear, lumped parameter model. This model uses a temperature-dependent heat transfer coefficient which accounts for the natural, mixed, and forced convection regimes and radiative heat transfer. The accuracy of the model is verified experimentally using one package size. The model is then used to predict the thermal performance of other package sizes and to rationalize the high level of thermal performance exhibited by the package

Keywords

convection; cooling; digital simulation; heat radiation; integrated circuit packaging; plastic packaging; SuperBGA package; forced convection; mixed convection; natural convection; nonlinear lumped parameter model; package size; radiative heat transfer; temperature-dependent heat transfer coefficient; thermally enhanced ball grid array package; Bonding; Electronic packaging thermal management; Electronics packaging; Heat transfer; Laminates; Nonhomogeneous media; Plastics; Predictive models; Thermal conductivity; Thermal resistance;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.477460

Filename

477460