Title :
Thermal characterization of vertical multichip modules MCM-V
Author :
Cahill, Ciaran ; Compagno, Anthony ; Donovan, John O. ; Slattery, Orla ; Mathuna, Séan Cian ó ; Barrett, John ; Serthelon, Isabel ; Val, Christian ; Tigners, J.-P. ; Stern, Jon ; Ivey, Peter ; Masgrangeas, Marc ; Coello-Vera, Augustin
Author_Institution :
Nat. Microelectron. Res. Centre, Cork, Ireland
fDate :
12/1/1995 12:00:00 AM
Abstract :
This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC´s in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections made on the outside faces of the tube. Thermal measurements mere carried out on two different sized modules containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V technology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W: 9 chip image processing system
Keywords :
multichip modules; plastic packaging; thermal analysis; transient analysis; 2 W; 3 W; DRAM module; MCM-V; image processing system; inter-chip electrical connections; package evaluation test chips; plastic molding compound; steady state results; thermal characterization; three dimensional cube; transient thermal results; vertical multichip modules; Image processing; Manufacturing processes; Multichip modules; Packaging; Plastics; Semiconductor device measurement; Size measurement; Steady-state; Testing; Virtual manufacturing;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
