Title :
Component vs. system burn-in techniques for electronic equipment
Author :
Whitbeck, Craig W. ; Leemis, Lawrence M.
Author_Institution :
Oklahoma Univ., Norman, OK, USA
fDate :
6/1/1989 12:00:00 AM
Abstract :
Simulation can be used to determine the effects of different combinations of in-process and system burn-in times. It is shown that optimal burn-in at each stage of component assembly is not always optimal for the final system. Simulation is used to evaluate a nonrepairable system and provides individual component burn-in times that optimize the mean residual life of the assembled system
Keywords :
electronic equipment testing; failure analysis; reliability theory; component burn-in; electronic equipment; mean residual life; nonrepairable system; reliability; system burn-in; Assembly systems; Electronic equipment; Electronic equipment testing; Logic; Materials handling; Optimization methods; Performance evaluation; Reliability; Soldering; System testing;
Journal_Title :
Reliability, IEEE Transactions on
