DocumentCode
1145190
Title
Correction to "A Simple Test Chip to Assess Chip and Package Design in the Case of Plastic Assemblin
Author
Alpern, Peter ; Wicher, V. ; Tilgner, R.
Volume
18
Issue
4
fYear
1995
Firstpage
862
Keywords
Adhesives; Assembly; Computer aided software engineering; Degradation; Optical films; Optical microscopy; Plastic packaging; Surface cracks; Testing; Thermomechanical processes;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/TCPMA.1995.477474
Filename
477474
Link To Document