DocumentCode :
1145279
Title :
Optimization of Microchannel Heat Sinks Using Entropy Generation Minimization Method
Author :
Khan, Waqar Ahmed ; Culham, J. Richard ; Yovanovich, M. Michael
Author_Institution :
Dept. of Eng. Sci., Nat. Univ. of Sci. & Technol., Karachi, Pakistan
Volume :
32
Issue :
2
fYear :
2009
fDate :
6/1/2009 12:00:00 AM
Firstpage :
243
Lastpage :
251
Abstract :
In this paper, an entropy generation minimization (EGM) procedure is employed to optimize the overall performance of microchannel heat sinks. This allows the combined effects of thermal resistance and pressure drop to be assessed simultaneously as the heat sink interacts with the surrounding flow field. New general expressions for the entropy generation rate are developed by considering an appropriate control volume and applying mass, energy, and entropy balances. The effect of channel aspect ratio, fin spacing ratio, heat sink material, Knudsen numbers, and accommodation coefficients on the entropy generation rate is investigated in the slip flow region. Analytical/empirical correlations are used for heat transfer and friction coefficients, where the characteristic length is used as the hydraulic diameter of the channel. A parametric study is also performed to show the effects of different design variables on the overall performance of microchannel heat sinks.
Keywords :
Knudsen flow; drops; heat sinks; heat transfer; microchannel flow; thermal resistance; Knudsen numbers; accommodation coefficients; channel aspect ratio; entropy generation; entropy generation minimization method; fin spacing ratio; friction coefficients; heat sink material; heat transfer; microchannel heat sinks; pressure drop; slip flow region; thermal resistance; Entropy; Genetic expression; Heat sinks; Heat transfer; Microchannel; Minimization methods; Optimization methods; Resistance heating; Thermal resistance; Weight control; Analytical model; entropy generation minimization; microchannel heat sinks; optimization;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2009.2022586
Filename :
5170253
Link To Document :
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