Title :
Wide-band finite ground coplanar (FGC) interconnects for on-chip packaging of RF MEMS switches used in smart antennas and phased arrays
Author :
Morton, Matthew A. ; Papapolymerou, John
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A wide-band finite ground coplanar (FGC) interconnect is presented for use in thermal compression bonded packages for RF MEMS devices that are used for the development of smart antennas and electronically steered phased arrays at up to 50 GHz. The fabrication process is compatible with standard IC fabrication techniques, and allows for simple, high-performance, and cost-effective on-chip packaging of such devices on the same substrate as the antenna elements. The measured attenuation is approximately 0.25 dB per interconnect, and is relatively constant from 2 to 50 GHz.
Keywords :
UHF integrated circuits; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; micromechanical devices; microswitches; microwave integrated circuits; millimetre wave integrated circuits; 2 to 50 GHz; RF MEMS devices; RF MEMS switches; electronically steered phased arrays; finite ground coplanar interconnect; on-chip packaging; smart antennas; standard IC fabrication techniques; thermal compression bonded packages; wideband interconnect;
Journal_Title :
Antennas and Wireless Propagation Letters, IEEE
DOI :
10.1109/LAWP.2004.836573
